21.05.2012 cy5111a - wy 1 of 3 cy5 111 a - wy technical data visible led 5 mm features applications ? high luminous leds ? 5mm round standard directivity ? long lifetime operation ? superior weather - resistance ? uv resistant epoxy ? water clear type ? automotive dashboard lighting ? traffic signa l lamp ? back lighting ? other lighting diretivity: outline dimension: absolute maximum ratings (t a =25c) item symbol value unit power dissipation p d 1 68 mw forward current i f 70 ma pulse forward current * i fp 120 ma reverse voltage v r 5 v operating temperature t opr - 30 ? +85 c storage temperature t stg - 40 ? +100 c soldering temperature (5 sec.) t sol 260 c * pulse width max. 10 ms, duty ratio max. 1/10 specifications (t a =25c) item condition symbol min. typ. max. unit optical specifications luminous intensity * 1 i f = 2 0 ma i v 18 22 25 cd dominant wavelength i f = 2 0 ma d 5 85 5 90 5 95 nm viewing angle i f = 2 0 ma 2 1/2 - 15 - deg electrical specifications forward voltage i f = 2 0 ma u f 1.8 2.0 2.4 v reverse voltage v f = 5 v u r - - 10 a * 1 tolerance of chromaticity coordinates is 10% * 2 tolerance of luminous intens ity is 15% pin function 1 led anode 2 led cathode unit: mm tolerance: 0.3 mm
21.05.2012 cy5111a - wy 2 of 3 typical performance curves maximum forward dc current precaution for use 1. cautions ? do not look directly into the light or look through the optical system. 2. lead forming ? when forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. do not use the base of the leadframe as a fulcrum during lead forming. ? lead forming should be done before soldering. ? do not apply any bending stress to the base of the lead. the stress to the base may damage the led?s chara cteristics or it may break the leds. ? when mounted the leds onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of leds. if the leds are mounted with stress at the leads, it causes deterioration of the lea d and it will degrade the leds. 3. soldering conditions ? solder the leds no closer than 3 mm from the base of the lead. ? recommended soldering conditions: dip soldering pre - heat 120 c max. pre - heat time 60 seconds max. solder bath temperature 260 c max. dipping time 5 seconds max. dipping position no lower than 3 mm from the base of the epoxy bulb ? do not apply any stress to the lead particularly when heat. ? the leds must not be reposition after soldering. ? after soldering the leds, the lead sh ould be protected from mechanical shock or vibration until the leds return to room temperature.
21.05.2012 cy5111a - wy 3 of 3 ? when it is necessary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. ? cut the led leads at room temperature. cutting the leads at high temperature may cause the failure of the leds. 4. static electricity ? the leds are very sensitive to static electricity and surge voltage. so it is recommended that a wrist band or an anti - electrostatic glove be used whe n handling the leds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equipment that mounts the leds. 5. heat generation ? the powered leds generate heat. heat dissipation should be considered in the application design to avoid the environmental conditions for operation in excess of the absolute maximum ratings.
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